Our industrial and systems engineers are combining intelligent automation, direct printing, and real-time monitoring to improve every step of semiconductor manufacturing. That means faster prototyping, less waste, and more flexibility to support advanced technologies like chiplets, flexible electronics, and even electronics built in space.
They are also developing predictive models, anomaly detection systems, and digital twins to help manufacturers fine-tune performance and scale production with confidence.
By taking a practical, forward-looking innovation approach, we’re able to meet the semiconductor industry where it’s going, not just where it’s been.

Latest News
Exploring Decades of Semiconductor Collaboration between Argonne National Lab & UW–Madison
UW–Madison and Argonne National Laboratory have built a portfolio of shared research for decades. Read how semiconductor researchers from all interest areas have benefited from this affiliation.
New facility establishes UW-Madison as a hub for next-generation semiconductors
UW–Madison has launched a state-of-the-art facility focused on ultra-wide bandgap semiconductors, positioning the university as a key player in next-generation chip research and industry collaboration.
Spotlight on Workforce Development: Wisconsin CHIPS Panel Tackles Semiconductor Industry Needs
Wisconsin CHIPS faculty are organizing a panel on Workforce Development for the U.S. Semiconductor Industry at the IEEE conference hosted by UW–Madison, August 4–6, 2025.
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