Our industrial and systems engineers are combining intelligent automation, direct printing, and real-time monitoring to improve every step of semiconductor manufacturing. That means faster prototyping, less waste, and more flexibility to support advanced technologies like chiplets, flexible electronics, and even electronics built in space.
They are also developing predictive models, anomaly detection systems, and digital twins to help manufacturers fine-tune performance and scale production with confidence.
By taking a practical, forward-looking innovation approach, we’re able to meet the semiconductor industry where it’s going, not just where it’s been.

Latest News

New UW-Madison center accelerates discovery where materials meet their limits
A team of University of Wisconsin-Madison engineers has received nearly $25 million from the U.S. National Science Foundation for an initiative that leverages AI to accelerate discovery and development of “super” materials that can withstand …

UW–Madison and SKKU Team Identifies ‘Zinc Oxide Spin Qubit’ — A Semiconductor-Based Quantum Technology
Insider Brief Researchers from Sungkyunkwan University, the University of Wisconsin–Madison, and the University of Washington identified a molybdenum–oxygen-vacancy defect in zinc oxide that theoretical simulations indicate could serve as a high-performance spin qubit for quantum computing, communications, and …

Six ECE faculty appointed to named professorships
The Department of Electrical and Computer Engineering (ECE) and Wisconsin CHIPS are pleased to recognize six affiliate faculty members who have been appointed to named professorships. These appointments recognize outstanding achievements in research, teaching, and service …
- More News