Our industrial and systems engineers are combining intelligent automation, direct printing, and real-time monitoring to improve every step of semiconductor manufacturing. That means faster prototyping, less waste, and more flexibility to support advanced technologies like chiplets, flexible electronics, and even electronics built in space.
They are also developing predictive models, anomaly detection systems, and digital twins to help manufacturers fine-tune performance and scale production with confidence.
By taking a practical, forward-looking innovation approach, we’re able to meet the semiconductor industry where it’s going, not just where it’s been.

Latest News

Entrepreneurship Hub announces SEED grant recipients
Six projects across four University of Wisconsin–Madison schools and colleges, including one to utilizing quantum sensors, have received annual State Economic Engagement & Development (SEED) funding, totaling $550,000. The SEED Research Program funds are designated by the state legislature and administered by …

$27M WARF investment fuels UW–Madison’s next frontiers in research
The gift aims to accelerate four high-impact research initiatives at the university: quantum technologies, brain health, fusion energy and national security. A $27 million investment from the Wisconsin Alumni Research Foundation (WARF) will accelerate four …

Lab-to-Market Translation of 2D Semiconductors for Advanced Computing
Wisconsin CHIPS faculty Daniel Rhodes and collaborator Yangchen He are commercializing new materials for advanced computing. With support from the NSF I-Corps program and the Wisconsin MRSEC Advanced Materials Industrial Consortium, Rhodes and He have …
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